Insulating Adhesive "SI Series"
High thermal conductivity types using AIN and BN fillers are also possible! They excel in low stress and low curing shrinkage.
We would like to introduce our insulating adhesive "SI Series." High thermal conductivity types using AIN and BN fillers are also available. We offer a selection of various fillers and shapes, and further optimize resin performance, resulting in excellent low stress and low curing shrinkage. 【Features】 ■ High thermal conductivity types using AIN and BN fillers are also available ■ A selection of various fillers and shapes, and further optimization of resin performance, resulting in excellent low stress and low curing shrinkage *For more details, please refer to the PDF document or feel free to contact us.
- Company：アンドウ・ディーケイ 藤沢事業所
- Price：Other
